Reaction Bonded Ceramics

Metal Matrix Composites

Ceramics and Metal Matrix Composites

II-VI provides customers with material solutions using our advanced composite materials, manufacturing expertise, and application skills. Our core material engineering group continues to formulate solutions for products in the industrial wear, nuclear, armor, LCD glass, semiconductor capital equipment, chip manufacturing, solar, oil and gas and refractory industries.

II-VI’s materials can be tailored to match critical system performance needs including CTE, thermal conductivity, modulus, etc. II-VI’s materials technology is scalable both in terms of high volume production and in the size and complexity of product shapes.

II-VI provides the marketplace with products that improve performance and improve the return on investment for our customers.

材料

Metal Matrix Composites

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Full Materials Table

财产 Aluminum Metal Matrix Composites Reaction Bonded SiC Specialty Reaction Bonded Ceramics
GREEN BLUE GOLD SSC-702 SSC-802 SSC-902 SSC-FG HSC-702 TSC-15 RBBC-751
(Al/SiC) (Al/SiC) (Al/SiC) (Si/SiC) (Si/SiC) (Si/SiC) (Si/SiC) (Si/SiC+Al) (Si/SiC+Ti) (B4C/SiC/Si)
Density (g/cc) [ρ] 2.78 2.87 2.96 2.95 3 3.12 2.94 3.01 3.13 2.56
Poisson’s Ratio 0.29 0.28 0.25 0.18 0.18 0.18 0.18 0.19 0.19 0.18
Young’s Modulus (GPa) [E] 125 150 200 350 380 410 330 330 390 400
CTE avg 20-100ºC (ppm/K) [α] 15 12 11 2.9 2.9 2.7 3.0 4.4 3.0 4.8
Thermal Conductivity (W/m-K) [k] 160 160 160 170 180 190 150 200 210 52
Specific Heat (J/kg-K) 820 750 730 680 670 660 680 700 670 890
Ultimate Tensile Strength (MPa) 370 370 340 NA NA NA NA NA NA NA
Flexural Strength (MPa) NA NA NA 270 280 280 350 275 225 280
Fracture Toughness (MPa-m1/2) 15 14 13 4 4 4.0 4.0 5.0 5.0 5.0
Damping Factor (% Zeta) 0.24 0.26 0.58 0.12 --- --- --- --- ---
Specific Stiffness (E/ρ) 45 52 68 119 127 131 112 109 125 156
Thermal Stability (k/α) 11 13 14 59 62 70 50 45 70 11

II-VI Incorporated Introduces Silicon Carbide Ceramic Materials with Record Thermal Conductivity of 255 W/(m-K) for Power Electronics Modules

II-VI Incorporated Introduces Silicon Carbide Ceramic Materials with Record Thermal Conductivity of 255 W/(m-K) for Power Electronics Modules

2021年2月11日
II‐VI Incorporated (Nasdaq: IIVI), a leading provider of components based on reaction-bonded ceramics and metal-matrix composites, today announced that it introduced a new grade of its proprietary reaction-bonded silicon carbide ceramic material, with a record thermal conductivity of 255 W/(m-K), for power electronics applications, including IGBT baseplates. The growing interest in clean energy is accelerating the electrification of the global...
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